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MLO TM Inductors
AUTOMATED SMT ASSEMBLY
The following section describes the guidelines for automated
SMT assembly of MLO TM RF devices which are typically Land
Grid Array (LGA) packages or side termination SMT packages.
Control of solder and solder paste volume is critical for
surface mount assembly of MLO TM RF devices onto the PCB.
SMT REFLOW PROFILE
Common IR or convection reflow SMT processes shall be
used for the assembly. Standard SMT reflow profiles, for
eutectic and Pb free solders, can be used to surface mount
the MLO TM devices onto the PCB. In all cases, a temperature
gradient of 3°C/sec, or less, should be maintained to prevent
warpage of the package and to ensure that all joints reflow
properly. Additional soak time and slower preheating time
Stencil thickness and aperture openings should be adjusted
according to the optimal solder volume. The following are
general recommendations for SMT mounting of MLO TM
devices onto the PCB.
may be required to improve the out-gassing of solder paste.
In addition, the reflow profile depends on the PCB density
and the type of solder paste used. Standard no-clean solder
paste is generally recommended. If another type of flux is
used, complete removal of flux residual may be necessary.
Example of a typical lead free reflow profile is shown below.
Tp
T L
Ts max
Ramp-up
tp
t L
Critical Zone
T L to Tp
Ts min
ts
Preheat
Ramp-down
25
t 25oC to Peak
Time
Figure A. Typical Lead Free Profile and Parameters
Profile Parameter
Ramp-up rate (Tsmax to Tp
Preheat temperature (Ts min to Ts max)
Preheat time (ts)
Time above T L , 217oC (t L )
Peak temperature (Tp)
Time within 5oC of peak temperature (tp)
Ramp-down rate
Time 25oC to peak temperature
Pb free, Convection, IR/Convection
3oC/second max.
150oC to 200oC
60 – 180 seconds
60 – 120 seconds
260°C
10 – 20 seconds
4oC/second max.
6 minutes max.
101
7
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